Chemical Mechanical Polishing of Data Processing and IC wafers

C. Fred Higgs III, Mechanical Engineering

The Particle Flow & Tribology Laboratory in the mechanical engineering department at Carnegie Mellon University is developingtest wafers for advanced data processing and storage capabilities. Next-generation IC and data storage nanotechnology with sub-50nm to 150nm features on silicon wafers will be tested. Chemical mechanical polishing (CMP) will be used to planarize the nano-features on wafer to a mirror finish in a fluid mechanics and tribology process. CMP testing will be conducted to obtain data for the proof of concept tests for integrated circuits (ICs) and next-generation data storage devices. Figure 10 shows a diagram of a patterned media wafer for high-density data storage. This wafer must be fabricated in the clean room using the latest techniques and engineering intuition.

We are looking for a motivated and talented research-honors undergraduate to:

• Help fabricate patterned media and IC devices in the cleanroom environment
• Learn cleanroom equipment and processes
• Learn to work basic metrology tools for surface characterization
• Operate the CMP machine when it arrives

Skills needed: Senior standing; Research honors status; Cleanroom skills (preferred but will be taught); Creativity.