Solder/Magnetic Nanoparticle Composites for Flip-chip Packaging
Michael McHenry, Materials Science and Engineering
Magnetic nanoparticle composites are being used for the improved reflow of Pb-free solders for flip-chip packaging. This project will investigate the effect of nanoparticles on altering the eutectic microstructures and improving the strength and ductility of the solder joints.