Chemical Mechanical Polishing from a Mechanical and Materials Science Engineering Perspective

C. Fred Higgs, Mechanical Engineering and Computer & Electrical Engineering

Profs. Burak Ozdoganlar and Higgs are working together to study chemical mechanical polishing (CMP) from the mechanical perspective as well as the material science perspective. CMP is a process where very rough thin films on a wafer are planarized to a mirror finish. The objective of the proposed work is to investigate the microstructural effects on the surface quality of planarized wafers with thin metal films through abrasive machining processes. Abrasive grinding and polishing (AGP) processes, including CMP, mechanical lapping, and microgrinding, are critical to the successful fabrication of microelectronic devices. The quality of the surfaces produced from various AGP processes significantly affects the performance characteristics of integrated circuits, next-generation data storage systems, and microelectromechanical systems (MEMS).

We are looking for a motivated and talented research-honors undergraduate to:

Help fabricate test wafers in the cleanroom environment
Learn cleanroom equipment and processes
Learn to work basic metrology tools for surface characterization

Skills needed:
Senior standing; Research honors status; interest in both mechanical engineering and material science.

Send resumes to: Prof. C. Fred Higgs III (email: higgs@cmu.edu) or Prof. Burak Ozdoganlar (email: burakoz@andrew.cmu.edu)
Higgs Lab: http://www.me.cmu.edu/faculty1/higgs
Ph.: 8-2486

Companies/Industries that have or are likely to approach professor for students to hire: Intel, Seagate, Hitachi, Texas Instruments, Nanotechnology/MEMS industry, Data Storage Industry

Internet References that provide extra knowledge:
http://www.nikon.co.jp/main/eng/products/cmp_e.htm
http://www.smalltimes.com/document_display.cfm?document_id=5309