Chemical Mechanical Polishing of Data Processing and IC Wafers
C. Fred Higgs, Mechanical Engineering and Computer & Electrical Engineering
The Particle Flow & Tribology Laboratory in the mechanical engineering department at Carnegie Mellon University is developing test wafers for advanced data processing and storage capabilities. Next-generation IC and data storage nanotechnology with sub-50nm to 150nm features on silicon wafers will be tested. Chemical mechanical polishing (CMP) will be used to planarize the nano-features on wafer to a mirror finish in a fluid mechanics and tribology process. CMP testing will be conducted to obtain data for the proof of concept tests for integrated circuits (ICs) and next-generation data storage devices.
We are looking for a motivated and talented research-honors undergraduate to:
- Help fabricate patterned media and IC devices in the cleanroom environment
- Learn cleanroom equipment and processes
- Learn to work basic metrology tools for surface characterization
- Operate the CMP machine when it arrives
Skills needed:
Senior standing; Research honors status; Cleanroom skills (preferred but will be taught); Creativity.
Send resumes to: Prof. C. Fred Higgs III (email: higgs@cmu.edu)
Higgs Lab: http://www.me.cmu.edu/faculty1/higgs
Ph.: 8-2486
Companies/Industries that have or are likely to approach professor for students to hire: Intel, Seagate, Hitachi, Texas Instruments, Nanotechnology/Semiconductor industry, Data Storage Industry